1DFAUL 300g Potting Compound for Electronics, Conformal Coating Clear Quick Dry, High and Low Temperature Resistance, Protects Transformers, Circuit Board from Moisture, Dust & Vibration (Clear)

• Protect Sensitive Circuits: Conformal coating builds a barrier for circuit boards! Effectively resist moisture, dust, dirt and vibration, sealing every gap. Prevent corrosion, short circuits and performance degradation caused by harsh environments, especially suitable for DIY electronic projects exposed to real environments
• Thermal Conductivity & Insulation: Potting Compound for Electronics the thermal conductivity effectively dissipates heat from sensitive components while providing strong insulation protection. Perfectly encapsulates transformers, high-voltage packages, ignition coils and AC/DC modules to prevent overheating and extend component life
• Precision Protection: The self-leveling formula of the conformal coating for electronics penetrates deep into the gaps, tightly wraps the components, and forms an impenetrable barrier to prevent arcing, leakage current and component aging, ensuring safe and reliable operation of the equipment
• DIY Easy Operation: After cleaning the surface, shake the conformal coating thoroughly. Then, mix component A and component B separately at a weight ratio of 1:2 until fully mixed. Pour the Potting Compound for Electronics mixture onto the circuit board surface and allow it to cure. (Initial curing takes 2 hours, full curing takes 6 hours)
• Electronic DIY Rnthusiasts: 200g+100g Potting Compound for Electronics set meets the needs of multiple projects! Protect electronic devices from harsh environments for a long time

Instructions for Use: 1. Clean the circuit board, ensuring the surface is free of debris, dust, and grease. 2. Shake well before use. 3. Black / White Version: Mix component A and component B at a weight ratio of 1:5 (not a volume ratio), stir thoroughly before use (weighing with an electronic scale is required). Clear Version: Mix component A and component B at a weight ratio of 1:2 (not a volume ratio), stir thoroughly before use (weighing with an electronic scale is required). 4. After mixing, pour the adhesive onto the circuit board surface. Allow it to cure naturally, allowing air bubbles to dissipate. Initial curing takes 2 hours, and complete curing takes 6 hours. Notice: 1. Shake well before use. 2. Weigh using an electronic scale. 3. Mix black and white versions at a 1:5 weight ratio and stir thoroughly before use. 4. Mix transparent versions at a 1:2 weight ratio and stir thoroughly before use. 5. Initial curing takes 2 hours; complete curing takes 6 hours.