sourcing map Vacuum Pen with 3 Suction Pads Desoldering Suction Pen Solder Extraction Removal Tool White for IC Surface Mounted Devices Chip Mobile Screen Replacement

• Pen Size: 15 x1.2cm / 5.9 x 0.5 inch (L*D)
• Color: White; Material: Plastic and Metal
• Package Content: 1 x Vacuum Pen with Bending Needle; 3 x Suction Cups
• This fast action solder removal tool will help you complete the task quickly and safely.
• 3 suction headers are provided with this handy suction pencil: large size for 40g, medium size for 18g, small size for 3g.

Description: 3 suction headers are provided with this handy suction pencil: large size for 40g, medium size for 18g, small size for 3g. Specification: Product Name: Vacuum Pen with Header Color: White Weight: 27g Material: Plastic, Metal Pen Size: 15 x1.2cm / 5.9 x 0.5 inch (L*D) Package Content: 1 x Vacuum Pen with 1 Bending Needle 3 x Suction Cups How to Install: a. Install a proper IC suction header on this suction pencil. b. Place the suction header lever on IC. c. Press down the button on the suction pencil to let out the air within the vacuum unit,then release the button to produce vacuum suction force to pick up IC. d. Put the IC on a proper place,press down the button,the vacuum unit discharges air to let the IC fall off the suction header.