

Solder Paste in jar 250g (T5) SAC305 no Clean
About this item
- Lead-Free / RoHS Compliant
Product description
Description Solder Paste in jar 250g (T5) SAC305 no clean 88% metal. Alloy: Sn96.5/Ag3.0/Cu0.5 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 88% metal by weight. Particle Size: T5 (15-25 microns) Melting Point: 217-220C (423-428F) Size: 250g jar Shelf Life Refrigerated >6 months, unrefrigerated >2 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
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Customer reviews
What customers say about Bigamart
10 Trustpilot reviews total, with 2 shown at a time.
I wrote to Bigamart's customer support and they accompanied the process of reshipping the item until it finally arrived. I felt a genuine effort to solve the problem till it was finally solved.
The package was here in Australia from England in a few days โ so quick! Something was missing and they refunded it straight away. Pretty happy with these guys.
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