

Low-Melting Solder Alloy Stick for SMD & BGA Component Removal – 6.5" Length – 58°C Melt Point – Lead-Free (2)
Options
1 availableAbout this item
- Low-melting solder alloy for SMD and BGA component removal
- Melting point: 79–91°C (174°F–195°F) – protects components from overheating
- 1x, 2x, 4x or 8x 6.5” sticks
- Lead-free, RoHS 3 compliant, and REACH compliant
- Ideal for electronics repair, PCB rework, and desoldering tasks
Product description
Easily remove SMD and BGA components with this low-melting point solder alloy stick, specifically formulated to simplify delicate rework and desoldering tasks. This lead-free, RoHS 3 compliant, and REACH compliant alloy melts between 79°C and 91°C (136°F), reducing the risk of PCB or component damage during removal. Each stick measures approximately 16.5cm (6.5"), and this pack includes 1, 2, 4 or 8 sticks (chose from the options above). Perfect for electronics repair technicians, hobbyists, and professionals needing a reliable low-temp desoldering solution.
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Customer reviews
What customers say about Bigamart
10 Trustpilot reviews total, with 2 shown at a time.
I wrote to Bigamart's customer support and they accompanied the process of reshipping the item until it finally arrived. I felt a genuine effort to solve the problem till it was finally solved.
The package was here in Australia from England in a few days — so quick! Something was missing and they refunded it straight away. Pretty happy with these guys.
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