Jelquix Kapton Heat Resistant Tape, High Insulation Adhesive Tape for BGA Chip Welding, 33m x 0.06mm, 250-300℃, 50mm Wide

• 【High Temperature Resistant Tape | Withstands 250-300℃】This kapton heat resistant tape is engineered to endure extreme temperatures from 250°C to 300°C, making it ideal for BGA chip welding, wave soldering, and other high-heat electronics applications. It maintains its integrity and insulation performance even under prolonged thermal exposure, ensuring reliable protection for sensitive components.
• 【Strong Adhesive with Clean Removal | No Residue Left Behind】The specially formulated silicone adhesive delivers a firm, secure bond during high-temperature processes, yet peels off cleanly without leaving sticky residue or surface damage after removal. This tape saves you cleaning time and protects your PCBs, connectors, and delicate electronic parts from contamination.
• 【High Extensibility & Peel Strength | Durable Long-Term Performance】Featuring over 35% extensibility and a peel strength of 5N/25mm, this polyimide tape resists tearing, stretching, and edge lifting during handling and thermal cycling. Its robust construction ensures consistent performance throughout your rework and repair tasks, reducing tape replacement frequency.
• 【Versatile BGA Welding Tape | Precision for Electronics Assembly】With a 33m length and 0.06mm thickness, this heat proof tape provides ample material for multiple BGA reballing, PCB masking, and insulation wrapping tasks. The 50mm width offers excellent coverage for large chips and boards, while the thin profile allows precise application without interfering with component placement.
• 【High Insulation Safety Tape | Protects Against Short Circuits】This high insulation adhesive tape delivers superior dielectric strength, effectively preventing electrical shorts and static discharge during live circuit work and soldering. It ensures a secure working environment for technicians, reducing the risk of accidental damage to expensive electronics and enhancing overall process safety.

1. [HIGH TEMPERATURE ] Withstanding 250-300℃, this tape is perfect for demanding applications. 2. [STRONG ADHESIVE FORCE] Special adhesive ensures no left behind after removal. 3. [DURABLE DESIGN] High extensibility over 35% and peel strength up to 5N/25mm for long-lasting performance. 4. [VERSATILE USE] Suitable for BGA chip welding due to its 33m*0.55mm size. 5. [SAFETY ENSURED] High insulation properties provide a secure working environment. Specification: Features: 300℃ high temperature resistant in the short run, 250℃ high temperature resistant for a long time. High extensibility that higher than 35% and high peel strength up to 5N/25mm enable this heat resistant adhesive tape to work for a very long time. High insulation ensures the safety. Adopting special adhesive with strong adhesive force to achieve no dirt left after peeling. 33m*0.55mm size makes the heat insulation adhesive tape suitable for BGA chip welding. Specification: Product type: Heat Insulation Adhesive Tape Thickness: approx. 0.06mm Length: approx. Stretchability: ≥35% Peel strength: 5N/25mm Tensile force: 135N/25mm Temperature resistant: Long time: 250℃; Short time: 300℃ Width: 20mm, 30mm, 50mm for your choice Package size: approx. 9.5 * 9.5 * 2 cm/ 3.74 * 3.74 * 0.79 in Package weight: 47g Package List: 1 * Heat Insulation Adhesive Tape