Germanium Doped Solder Paste No-Clean Sn/Cu0.7/Ni0.05/Ge0.006 T4 (250g jar)

• Lead-Free / RoHS 3 Compliant / REACH Compliant

Chip Quik CQ100GeTM Germanium Doped Solder Paste No-Clean Lead-Free Sn/Cu0.7/Ni0.05/Ge0.006 in 250g jar. This eutectic alloy has a uniform grain structure and produces bright shiny joints with no shrinkage. The germanium in our CQ100Ge alloy acts as an anti-oxidant which significantly reduces dross when used in solder pots and wave soldering machines. Alloy: Sn99.244/Cu0.7/Ni0.05/Ge0.006 Flux Type: Synthetic No-Clean Flux Classification: ROL0 Metal Content: 88.5% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 227C (441F) Size: 250g jar Shelf Life Refrigerated >6 months, unrefrigerated >2 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.