Gelid Solutions GP-Ultimate - Thermal Pad 120x20x2.0mm. Excellent Heat Conduction, Ideal Gap Filler. Easy Installation Thermal Conductivity 15W

• ULTIMATE THERMAL CONDUCTIVITY: With a thermal conductivity of 15W/mK, the GP-ULTIMATE offers first-class performance.
• SIMPLE APPLICATION: The GP-ULTIMATE is easy to use thanks to its thermal dimensions of 120x20mm.
• NON-ELECTRIC CONDUCTIVITY: The GP-ULTIMATE is non-electrically conductive, non-corrosive, non-hardening and non-toxic.
• PERFECT SIZES: The GP-ULTIMATE sizes are perfect for PCB surfaces, VGA cards, laptops, game consoles, microcontrollers, memory ICs and other SMD components.
• AVAILABILITY OF THE THIN: The GP-ULTIMATE is available in different thicknesses of 0.5mm, 1.0mm, 1.5mm, 2.0mm and 3.0mm.

The GP-Ultimate 120 × 20 offers a perfect thermal connection for heat transfer to the heat sink when it is installed on a circuit board with height differences and uneven surfaces such as, DRAM-ICs, VRM-ICs, power MOSFETs, NVRAM-ICs and other high-temperature SMD- Components is installed. Thanks to its improved multi-layer matrix, the superior material composition and the ultimate thermal conductivity of 15 W / mK, the GP-Ultimate 120 × 20 offers the best performance in its class. The GP-Ultimate 120 × 20 is non-electrically conductive, non-corrosive, non-hardening, non-toxic and supports an extended operating temperature range from -60 ° C to 220 ° C. It can be used seamlessly and has the heat pad dimensions of 120 x 20 mm, which are enlarged Optimally adapt the surfaces of RAM memory modules, GPU and CPU-VRM circuits, M.2 SSDs and other densely packed electronic devices.