YIHUA
⏳Price
$33.99
Home/DIY & Tools/Power, Garden & Hand Tools/Power Tools/Soldering & Desoldering Equipment/Soldering Stations
BGA Reballing Stencil Cell Phone CPU Tinning Stencil Cell for Phone BGA IC Chips Repair for S21 S21 Ultra Series
★★★★★
$33.99
Quantity
1
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About this item
- [Anti Sticking] With multiple IC slots on the body, which effectively prevent small IC from sticking tin and breaking corners.
- [Applicable CPU] This CPU reballing stencil is applicable for Qualcomm Snapdragon 888, for SM8350, for xyn2100 CPU.
- [Precise Positioning] Precisely made, the reballing template will accurately locate the CPU, with fast tin planting speed and high efficiency.
- [Stainless Steel Material] Made from stainless steel, the reballing stencil is high temperature resistant, will not easily deform.
- [Suitable Model] This BGA reballing template is suitable for S21 S21+ S21 Ultra series, for G998U G996U Z Flip3 Z Fold3 W 22, etc. phones.
Product details
Customer reviews
What customers say about Bigamart
10 Trustpilot reviews total, with 2 shown at a time.
Trustpilot
★★★★★
Excellent
4.5 average rating
S
Sigalit
🇮🇱 · January 2026
★★★★★
I wrote to Bigamart's customer support and they accompanied the process of reshipping the item until it finally arrived. I felt a genuine effort to solve the problem till it was finally solved.
V
Verified buyer
🇦🇺 · November 2025
★★★★★
The package was here in Australia from England in a few days — so quick! Something was missing and they refunded it straight away. Pretty happy with these guys.
Showing 1–2 of 10 reviews
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