BiuZi BGA Reballing Stencil Set 130Pcs/Set Silver Stainless Steel Directly Heat Stencils Kit Bga Stencils

• High Quality Material These BGA reballing stencils are made of high quality stainless steel, ensuring durability and longevity with repeated use.
• HEAT RESISTANCE The stencils can withstand heating by a hot air machine without deformation, ensuring stability and reliability during the reballing process.
• WIDE RANGE OF SIZES With a total of 130 pieces and 6 different sizes, these BGA reballing templates offer versatility and flexibility to meet different reballing needs.
• Practical Specifications Each stencil is marked with their respective specifications, so you can easily choose the appropriate size for your specific needs.
• VERSATILE COMPATIBILITY These stencils are specially designed for reballing BGA chips on laptops, desktops, communication mainboards, north-south bridges and graphics cards, making them suitable for a wide range of applications.

These stencils are made of high quality material, can be heated by the hot air machine, it is quick and easy to modify the BGA IC. Features: These stencils are made of high quality stainless steel, the thickness of the steel mesh is perfect. They can be heated by the hot air machine, these stencils are not easy to deform when heated. There are 6 different sizes and a total of 130 pieces, enough to meet your different needs. The specifications are marked on the surface so you can choose them comfortably. It is specially designed for laptop, desktop, communication motherboard North-South bridge and graphics card, etc. all types of BGA chips. Specification: Material: stainless steel Colour: silver. Quantity: 130 pieces. Approximate weight: 268 g / 9.5 oz. Package contents: 3 x BGA stencils for 0.35 mm solder ball. 2 x BGA stencils for 0.4mm solder ball. 7 pieces x BGA stencils for 0.45 mm solder ball. 35pcs x BGA Stencils for 0.5mm Solder Ball 60pcs x BGA Stencils for 0.6mm Solder Ball 23pcs x BGA Stencils for 0.76mm Solder Ball